School of Engineering
Computing and Technology Building, CM015
+44 (0) 1772 89 4202
Subject Areas: Engineering
Dr Sabuj Mallik is Principal Lecturer and Academic Lead in Mechanical Engineering at School of Engineering, where he is overseeing academic provisions of mechanical, maintenance, motor sports, aerospace and computer-aided engineering. He specialises in engineering materials, manufacturing and reliability engineering with applications in electronics, automotive and aerospace sectors.
Dr Sabuj received a first class honours degree in Mechanical Engineering (with a record CGPA of 3.81 out of 4.0) from Bangladesh Institute of Technology, Khulna (now called Khulna University of Engineering and Technology) in 2001. He came into UK in 2003 and obtained his MSc in Mechanical and Manufacturing Engineering (with Distinction) in 2004 from the University of Greenwich. Through a funded studentship Sabuj obtained his PhD in the characterisation and modelling of time-dependent behaviours of lead free solder pastes from the University of Greenwich in 2009.
In the same year, Sabuj took up a Postdoctoral Fellow position with the Electronics Manufacturing Engineering Research Group at University of Greenwich. This was then followed by a Lecturer (2010) and Senior Lecturer (2012) positions in Engineering Materials, in the same institution. In 2014, he was subsequently promoted to Principal Lecturer in Mechanical Engineering. During his time in Greenwich, Sabuj also served as Admissions Tutor of Mechanical Programmes, Programme Leader for MSc Mechanical and Manufacturing Engineering and successfully lead the submissions of Mechanical Programmes for Accreditation.
Sabuj joined University of Central Lancashire in January 2016 as the Academic Lead in Mechanical Engineering and provides strategic leadership to mechanical, maintenance, motor sports, aerospace and computer-aided engineering provisions.
Erasmus+ Teaching Placement (at University of Applied Sciences, Dresden)
Shock and Vibration Testing
Consultancy -Cold Climate Testing of Heating, Ventilation and Air Conditioning Equipment
Teaching Mobility Fund for Teaching Placement (at University of Applied Sciences, Dresden)
Business Innovation in STEM sectors by work force up skilling (with Dr Pal Kulandaivel and Dr Steve Woodhead)
Investigation of solder joint reliability and failure analysis (Industrial Placement Project)
International Conference Travel Awards
Thermal Management Materials for ECU
HALT/HASS Testing of Temperature and Pressure Sensors
Membership and Chartered Engineer with Institute of Mechanical Engineers, UK and Engineering Council, UK (Membership Number: 80140727).
Fellow, Higher Education Academy, UK (Recognition Reference: 52885).
Attended and presented papers and posters in over 25 national and international conferences in the areas of electronics materials and manufacturing, microelectronics and reliability engineering. Sabuj also Chaired a number of conference sessions, including:
Chair for the 2014 International Conference on Mechanical Properties of Materials on Session 5 Electrical and Alloy Materials, Barcelona, Spain, 19 Dec, 2014.
Chair for the 2013 World Congress on Engineering on session XVII (day 3) of the International Conference of Mechanical Engineering (ICME), London, 3 -5 July 2013.
Chair for the International Welding and Joining Conference (IWJC) on session [FE1] Diffusion Bonding, Brazing, TLP Bonding, Soldering (day 4), Jeju, Korea, 8 – 11 May 2012.
Taught in various undergraduate and postgraduate modules including:
Materials and Manufacturing (Level 4)
Materials Selection and Design (Level 5)
Engineering Mechanics and Materials (Level 5)
Quality Engineering (Level 6)
Operations Management (Level 6)
Innovative Manufacturing Processes and Techniques (Level 7)
Supervision of undergraduate and postgraduate projects
Successfully supervised three PhD students to completion at University of Greenwich. Some examples of research projects are provided below:
1. Optimisation of Microelectronic Heat Sinks and Solder Thermal Interface Material using Finite Element Modelling Technique (PhD Project).
2. Thermo-mechanical and thermal performance of voided and un-voided lead-free solder thermal interface materials for chip-scale packaged power device (PhD Project).
3. Study of Intermetallic Compound Layer Formation, Growth and Evaluation of Shear Strength of Lead-Free Solder Joints (PhD Project).